Electronic Electroplating

The Electronic Electroplating Research Group is dedicated to addressing key scientific issues in the electroplating process, utilizing methods such as machine learning, data-driven approaches, simulation, and first-principles calculations to drive the intelligent and efficient transformation of electroplating research. The research covers various fields, from molecular design of electroplating additives to multi-scale simulations of the electroplating process. The development of an integrated electroplating platform provides a theoretical research platform for optimizing electroplating processes and developing additive formulations. The exploration of electroplating formulations and interface mechanisms offers new theoretical insights for innovation in the electroplating field, while the advancement of novel simulation methods provides new theoretical tools and research approaches for electroplating studies.

Research Directions

1. Integrated Electroplating Platform
   Develop an automated computational workflow based on machine learning potentials to efficiently predict key properties of electroplating additives such as adsorption energy, diffusion coefficients, and redox potentials. Combine LLM-based literature extraction, generative models, and molecular representation learning to predict plating filling effects, cyclic voltammetry (CVs) curves, and assist in designing electroplating additives, optimizing electroplating processes and formulations.
2. Electroplating Solution Formulation Research
   Combine molecular dynamics simulations and spectroscopic calculations to study the coordination environment of solvents, ions, and additives in different electroplating solutions, and their effects on electroplating outcomes, providing theoretical guidance for optimizing electroplating solution formulations and processes.
3. Electroplating Interface Mechanism Research
   Utilize first-principles molecular dynamics simulations and machine learning potentials methods to study the electrical double layer and its dynamic evolution in electroplating systems, uncovering the role of interfacial phenomena during electroplating and deeply understanding the electroplating reaction mechanisms and the impact of additives.
4. Development of Mathematical and Physical Models for Electroplating Interfaces
   Focus on multi-phase interface mathematical and physical modeling, studying the structure and physical-chemical properties of interfaces. Develop efficient numerical computing programs to achieve precise calculations and stable solutions for complex interface models.
5. Multi-Scale Simulation of Complex Electrochemical Systems
   Combine various computational methods from microscopic to mesoscopic scales to bridge the gap between scales, simulating the behavior and physical-chemical processes of additives during electroplating.

Frontier Outlook

We will continue to integrate artificial intelligence and computational simulations to drive the intelligent and efficient advancement of electroplating processes. Our research group looks forward to closely collaborating with academic and industrial communities both domestically and internationally to jointly promote the green development and innovative applications of electroplating technologies, creating an intelligent, full-chain optimization model for electroplating processes.